- 담당 업무 : 반도체 자동화 설비 및 지그 설계 
              삼성 모바일 디스플레이(휴대폰) 공정 설비및 지그류 제작 
              주로 AUTOCAD와 SOLID WORKS를 이용한 2D, 3D설계업무이나 
              조립, 검수, 납품 등 전반적인 업무를 분할하여 담당 
              경력에 따른 급여조정 
              
- 우대 사항: 전산응용기계제도기능사(우대) 
             기타 : atc 1급, solid works 
            
-급여 :  연봉 30,000,000원 이상 ~ 50,000,000원 이하 
         상여금 별도 : 0% 
         면접 후 결정 가능 
        
-복리후생 : 4대보험
                 
-근무형태 : 주 5일 근무
             
- 근무시간 : (오전) 8시 30분~(오후) 5시 30분 
       
- 근무지주소: 충청남도 천안시 서북구 두정공단1길 55 (두정동) 

- 접수기간 : 2018년 11월 25일                           
                                                 
                                         
                                     
                       **입사 지원 및 기타 사항 해당 사이트 참고**


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